New iPhone, difficulties in the production of the chip, with 3D NAND! – Rumor
As reported by Digitimes, the Apple supplier that you are dealing with the production of the new chip storage for iPhone 8, iPhone 7s, and iPhone 7s Plus are experiencing different issues, so as to force Apple to call Samsung...
Specifically, suppliers SK Hynix and Toshiba would have decreased the production of the 30%, because of low yields in the performance of the chips and 3D NAND. For this reason, Apple would have turned to Samsung to help bridge this gap and not end up with supply problems.
The chip NAND used by Apple on the iPhone is a non-volatile memory that can be considered as the equivalent to the mobile hard disk or a SSD. The 3D NAND is formed from a stack of layers of memory cells that can store much more information in the same physical space. Apple has started to use the 3D NAND on the iPhone 7 and 7 Plus, however, their production has always registered some difficulties in terms of performance.
For this reason, in order to avoid any risk, Apple has also added Samsung to the list of suppliers of this chip, together with SK Hynix and Toshiba.
Link to the original article: New iPhone, difficulties in the production of the chip, with 3D NAND! – Rumor