Chipworks disassembles the iPhone IF: many components taken from the iPhone 6s and 5s
Chipworks has put their hands on the new iPhone IF to take it apart and find out the hardware hidden on the inside. Let us immediately say that many of the components are the same as the iPhone 5/5s and the iPhone 6s.
Let's start from the processor: the chip A9 used on the iPhone IF it is the same on iPhone 6s, with a lot of diversification between the processors manufactured by TSMC and processors products from Samsung (at a practical level it does not change anything). Also the RAM is the same 2GB LPDDR4, just like on the iPhone 6s. From the label of the RAM, we find that the production of these components dates back to August or September, then it is likely to be parts originally the products to be assembled on the iPhone 6s or 6s Plus. The 16GB flash memory was manufactured by Toshiba.
The controller of the touchscreen is the same used by Apple on the iPhone 5s (CM5976 Broadcom and Texas Instruments 343S0645). The NFC chip is the model NXP 66VIO, the same as on the iPhone 6, while the inertial sensor 6-axis gyroscope and accelerometer is the same model found on the iPhone 6s. The same is true of the modem, model Qualcomm MDM9625M, and integrated circuits related to audio handling.
However, there are some of the components unpublished on this iPhone THOUGH, as the module of power amplifier Skyworks SKY77611, the power management IC Texas Instruments 338S00170, the NAND Flash Toshiba THGBX5G7D2KLDXG, the microphone AAC Technologies 0DALM1 and the switch for the antenna module EPCOS D5255.
Link to the original article: Chipworks disassembles the iPhone IF: many components taken from the iPhone 6s and 5s