From Qualcomm, and Samsung hardware solutions for headsets TWS by the exceptional @BitFeedCo.

The earphones TWS have become among the electronic devices more popular to buy (something that has gone hand in hand with the removal of the audio jack from many of the flagship smartphone). Two of the biggest problems with this kind of accessories are the audio quality and battery life. Luckily, manufacturers are quick to improve their technologies, and a big hand is going to come from either Qualcomm, Samsung.

Samsung and Qualcomm are two of the largest companies involved in the production of components for the earphones TWS and both have just announced new chips to improve the autonomy and the quality of the audio.

Samsung PMIC MUA01 and MUB01

The first announcement comes from the Korean manufacturer. Samsung has launched and made available a new integrated circuit, power management (PMIC), which is already present in its Samsung Galaxy Buds+ (not in the case of the most commended for autonomy).

The PMIC MUA01 and MUB01, which are chips, respectively, for the charging case and earbuds TWS, have the aim to extend the autonomy. The press release mentions that Samsung was able to put together up to ten different components in a single PMIC, reducing the size by half compared to its alternatives earlier. The smaller size of the units leave more space for the battery, which translates into a better autonomy.

Both units are equipped with a microcontroller and embedded flash memory, which simplifies the task of upgrading and / or changing the firmware. MUA01, the PMIC for the charging case, includes support for charging, both wired and wireless (according to the standard Qi 1.2.4 of the Wireless Power Consortium).

SoC Qualcomm QCC514X and QCC304X

Regarding Qualcomm, has unveiled a new Bluetooth system-on-chip for wireless headsets. QCC514X and QCC304X are the SoC’s most recent company devices, TWS premium and entry-level, respectively.

Both are equipped with support for Voice Assistant and the active noise cancellation hybrid (ANC hybrid) of Qualcomm at the hardware level. Qualcomm also promises “audio quality and voice wireless premium”.

Furthermore, the SoC supports the new technology TrueWireless Mirroring of Qualcomm. According to the press release, with this technology, “a headset is connected wirelessly to the phone via Bluetooth, while the other interface with the other“.

In short, it is reasonable to expect a 2020 chock-full of the new generations of headsets TWS.

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From Qualcomm, and Samsung hardware solutions for headsets TWS by the exceptional @BitFeedCo.